Displaying items by tag: Qualcomm

Zebra has established itself as a leading provider of computing devices for manufacturing, logistics, warehousing, transport, medical, retail, and other fields. And now the company is working to add AI smarts to make its tools do more, aiding companies in more error-free, theft-resistant, packing, picking, and selling processes.

Singapore's largest telco Singtel and chipset maker Qualcomm have claimed the successful completion of a proof of concept (POC) trial of an AI-enabled Home WiFi gateway.

Qualcomm Technologies has announced its Snapdragon 6 Gen 4 Mobile Platform, which the chipset maker is promoting as a platform for the universal user, having something for everyone from gassed up gaming to GenAI support.

Giant Indian telco Bharti Airtel has chosen Nokia and chipmaker Qualcomm for a program to develop 5G Fixed Wireless Access (FWA) and Wi-Fi 6 solutions for high-speed internet access to underserved areas across India.

Telstra in collaboration with telecoms vendor Ericsson and mobile chipset OEM Qualcomm claims to have set a record uplink speed of 516 Mbps, surpassing the previous record of 447 Mbps set in October 2024.

Japanese technology JV Sony Honda Mobility (SHM) and smartphone chipmaker Qualcomm have expanded their technology collaboration to integrate the latest generation of Qualcomm's Snapdragon Digital Chassis solutions into SMH's future AFEELA brand vehicles.

Singapore-based satellite-to-device broadcaster Astrum Mobile and smartphone chipmaker Qualcomm have jointly completed what they claim is the world's first 5G broadcast services trial using a satellite in geosynchronous orbit to a retail smartphone.

Deutsche Telekom has partnered with chipmaker Qualcomm and geostationary satellite network services provider Skylo to conduct an end-to-end trial at Telekom's Cosmote subsidiary of SMS send and receipt messages over GEO satellite.

Mobile operator Vodafone, chipmaker Qualcomm and telecoms vendor Ericsson announced a demonstration of claimed benefits of Millimetre wave (mmWave) 5G technology through two trials recently conducted in the UK.

Widespread reports say chip designer Arm Holdings is canceling a license that allowed mobile chipset heavyweight Qualcomm to use Arm IP in its chips, in a legal dispute over vital smartphone technology which could threaten the bottom line of both companies.

Smartphone CPU maker Qualcomm has announced a new version of its Snapdragon 7 chipset series - the Snapdragon 7s Gen 3 Mobile Platform - which the company says builds on the 7-series momentum of bringing enhanced capabilities to the mid-range smartphones market.

Semiconductor company Qualcomm unveiled the Snapdragon 4s Gen 2 Mobile Platform, a chip, which the company claims, will make 5G more accessible and reliable.

Vodafone, semiconductor company Qualcomm, and Chinese smartphone maker Xiaomi have tested a new 5G technology in Germany and Spain capable of download speeds close to 1.8 gigabits-per-second (Gbps) using a new smartphone.

Finnish telco vendor Nokia and British telco BT announced they successfully aggregated 5G Standalone (SA) spectrum using 5CC Carrier Aggregation (5CC CA). Nokia said BT is the first European operator to achieve this milestone.

Close on the heels of its move to tighten the screws on China with respect to chip exports, the United States has now decided to revoke licences for supply of Intel and Qualcomm hardware to Huawei Technologies.

Information and communication technology solutions provider ZTE has collaborated with China Mobile’s Zhaijiang branch and Qualcomm to achieve a 5.4Gbps peak data rates.

Consumer electronics company Lenovo will expand its 8.8-inch Lenovo Legion Tab from China to select markets in Europe, Middle East, and Africa, and Asia.

Deutsche Telekom will present a “visionary” AI phone concept in collaboration with semiconductor company Qualcomm and Brain.AI at the Mobile World Congress 2024.

Samsung Research America (SRA), the research and development arm of Samsung Electronics, has partnered with Princeton University to develop 6G wireless and networking systems.

EchoStar subsidiary Dish Wireless has bagged a US$50 million grant from the US Department of Commerce’s National Telecommunications and Information Administration (NTIA), which will be used to fund and establish the Open RAN Centre for Integration & Deployment (Orcid).