Direct chip-to-chip interconnect allows significant power and silicon area savings while retaining all performance features of the USB 2.0 standard.
Seminar programme for National Electronics Week on 12th - 13th April 2011 in the Pavilion of the NEC.
Improved technology parameter, sub-circuit identification and analog circuit optimisation bring improved productivity to analog and RF circuit designers
Hardware design specialist Libelium opens a new community site for electronics enthusiasts offering a wide range of tutorials, cost-effective products, news, customer service and user-created hacks & recipes.
Canon has developed the world's largest CMOS image sensor - a huge 202 by 205mm chip.
VLSI Solution has today announced VSIDE - the Integrated Development Environment for VSDSP Processor Family.
Cambridge Wireless is Unlocking New Semiconductor Opportunities in Connectivity 20th May 2010, Cambridge, UK
Uses standard CMOS technologies and lines to slash MEMS costs by up to two thirds
Lauterbach and Cortus are pleased to announce that the Lauterbach TRACE32® Power Tools now fully support the Cortus APS3 family of processors.
A seemingly impossible sparkle of green light from a silicon chip has opened up a whole new field of possibilities for communications devices, including exponentially shrinking the hardware needed to guarantee high quality Internet connection, according to researchers at the University of Sydney.