Cortus S.A., MagnaChip Semiconductor Corporation and Taegee Company, Ltd., have collaborated to develop an advanced, low power
With only a week to go the team at New Events are looking forward to a great show, with a wide variety of exhibitors, new products and services, competitions, workshops, seminars and much more.
Further details announced for the UK's premier electronics trade exhibition - a showcase of cutting-edge technology that is both fun and educational.
NEW:UK at the NEC Birmingham offers visitors a wealth of learning and the opportunity to see 100's of different products and services on display
With the ability to be placed in various serial & parallel I/O configurations, including a proprietary dynamic bi-directional data bus
Unique combination of design and manufacturing tools will accelerate lithography qualification and improve chip yields
AgOInc extends AnXploreranalog and RF circuit optimisation tool with new algorithms to port circuits between similar technologies
The combination of Magma's Titan and FineSim software and LFoundry's process technology will accelerate development of analog/mixed-signal (AMS) products, especially for European system-on-chip (SoC) developers.
Joint master class to unlock the potentials in Wireless Sensing
Join LeCroy and Evatronix for a real-life engineering guide on the USB 3.0 standard and its hardware and software limitations.
Latest SW/FW version adds stacked VLANs management
Direct chip-to-chip interconnect allows significant power and silicon area savings while retaining all performance features of the USB 2.0 standard.
Seminar programme for National Electronics Week on 12th - 13th April 2011 in the Pavilion of the NEC.
Improved technology parameter, sub-circuit identification and analog circuit optimisation bring improved productivity to analog and RF circuit designers
Hardware design specialist Libelium opens a new community site for electronics enthusiasts offering a wide range of tutorials, cost-effective products, news, customer service and user-created hacks & recipes.
Canon has developed the world's largest CMOS image sensor - a huge 202 by 205mm chip.
VLSI Solution has today announced VSIDE - the Integrated Development Environment for VSDSP Processor Family.
Cambridge Wireless is Unlocking New Semiconductor Opportunities in Connectivity 20th May 2010, Cambridge, UK
Uses standard CMOS technologies and lines to slash MEMS costs by up to two thirds
Thanks for posting this - quite straightforward via myGov
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