Memory maker Micron has announced its first 3D NAND memory optimised for smartphones and SSD. It is based on Universal Flash Storage UFS 2.1 which is 33% faster than eMMC storage.
Just when you didn’t think memory could get any denser (there has to be a joke in that somewhere), Toshiba ups the ante and is shipping samples of the world’s first 64-layer, three-dimensional, stacked Flash memory.
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